I. Defining Test Standards and Equipment
Standard Selection: Select standards based on industry requirements, such as IEC 60068-2-2 (electronic products), ASTM E1952 (metallic materials), or GB/T 2423.2 (electrical products).
Equipment Preparation: High-temperature ovens, environmental test chambers, differential scanning calorimeters (DSC), thermogravimetric analyzers (TGA), etc., are required. Ensure accurate instrument calibration.
II. Test Procedure and Key Indicators
Sample Preparation: Prepare label samples according to standards and record initial conditions (size, weight, appearance).
Instrument Calibration: Use standard substances (such as indium, tin) to calibrate the temperature and heat of DSC, TGA, and other equipment.
Heating Program Setting: Set the heating rate (typically 5°C/min~20°C/min) and target temperature according to standards.
Data Acquisition and Analysis: Record parameters such as heat flow, mass change, and deformation, and analyze characteristic temperature points (e.g., the initial decomposition temperature, Tonset) using software.
Failure Determination: Determine the maximum withstand temperature by combining visual observation (e.g., discoloration, cracking) and performance data (e.g., a 50% decrease in strength).
III. Test Methods and Standards
Constant Temperature Aging Test: Place the tag in a constant high-temperature oven and examine its performance changes over a long period.
Thermal Shock and Cyclic Testing: Rapidly switch between high and low temperatures to simulate real-world environments with repeated start-stop cycles and sudden temperature changes.
Accelerated Life Testing (ALT): Accelerate material aging by increasing temperature to predict the long-term lifespan of the tag.
Functional Testing and Data Retention Verification: Periodically read tag data under high-temperature conditions to ensure that the stored information is not affected.
IV. Practical Applications and Cases
RFID High-Temperature Resistant Tags: Tested under a 300℃ high-temperature and high-pressure environment, ceramic substrate tags can withstand temperatures up to 250~300℃, with a longer withstand time than PCB tags.
GJB150.9A-2009 Damp Heat Test: Stabilize the temperature to 30°C, 95%RH, cycle 10 times, and test the label's performance under damp heat conditions.
V. Precautions
Material Selection: The heat distortion temperature (HDT) of ordinary PP is usually around 100°C, while modified high-temperature resistant PP can reach 150°C or even higher.
Long-Term Thermal Aging Performance: Attention should be paid to the material's thermo-oxidative aging indicators. For example, PP materials certified by UL Yellow Card usually indicate their long-term operating temperature range.
Chemical Stability: High-temperature environments often involve the risk of chemical corrosion; attention should be paid to the material's resistance to certain solvents or oils at high temperatures.
